Changfeng Alliance Internet Information Services Promotion Working Group

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At present, the domestic semiconductor industry is accelerating its drive toward self-reliance, with the sector’s focus shifting from “mass production and widespread adoption” to a high‑quality development phase centered on refining manufacturing processes, enhancing performance, and improving stability. Conventional general‑purpose semiconductor devices commonly suffer from high high‑frequency losses, large temperature coefficients, inadequate stability under extreme operating conditions, and significant consistency deviations—issues that make them ill‑suited to meet the stringent requirements of high‑end applications such as industrial control systems, high‑frequency communications, and precision smart equipment. Consequently, advancing process technology has become the core strategic imperative for breaking through in China’s domestic semiconductor industry at this stage.

At present, the domestic semiconductor industry is accelerating its drive toward localization, with the sector’s focus shifting from “mass production and widespread adoption” to a high‑quality development phase centered on refining manufacturing processes, enhancing performance, and improving stability. Conventional general‑purpose semiconductor devices commonly suffer from high high‑frequency losses, large temperature coefficients, inadequate stability under extreme operating conditions, and significant consistency deviations—issues that make them ill‑suited to meet the stringent requirements of high‑end applications such as industrial control systems, high‑frequency communications, and precision smart equipment. Consequently, advancing process technology has become the pivotal key to breaking through in China’s domestic semiconductor industry at this stage.

Focusing on optimizing core manufacturing processes for discrete semiconductor devices and power‑electronics components, and leveraging a robust foundation of established technologies, we are undertaking in‑depth R&D efforts across critical production stages—including wafer dicing, chip packaging, circuit routing, and parameter calibration. By moving away from conventional, unrefined process approaches and adopting refined process control, structural topology optimization, and advanced material‑composition upgrades, we have effectively enhanced key performance metrics such as on‑state conduction loss, switching speed, and voltage‑withstand stability, thereby significantly narrowing the performance gap with leading international high‑end devices.

At the process‑implementation level, a full‑process quality‑control system has been established, covering everything from early‑stage chip design and simulation, through mid‑stage precision manufacturing, to late‑stage aging tests and parameter screening. This ensures standardized, finely tuned control at every stage, effectively addressing key challenges in the mass production of domestically manufactured devices—namely poor parameter consistency, unstable yield rates, and rapid performance degradation over long operating periods. Following multiple rounds of process iteration and refinement, the optimized semiconductor devices exhibit core advantages such as low power consumption, high voltage tolerance, electromagnetic interference immunity, and robust resistance to extreme temperatures, making them ideally suited for demanding applications including industrial high‑frequency start‑stop operations, harsh outdoor environments, and precision electronic control systems.

Industry data indicate that advancing process sophistication has become a core competitive advantage in specialized semiconductor segments, with growing opportunities for domestic substitution of high-end, precision‑grade semiconductor devices. Moving forward, the company will continue to deepen innovation in manufacturing processes, focusing on breakthroughs in miniaturization, high integration, and low‑loss device technologies, while relentlessly refining product performance. By leveraging robust process capabilities, it aims to drive the domestic semiconductor industry toward higher‑end, more precise, and higher‑quality offerings, thereby filling the gap in China’s market for high‑end, precision components.

Breaking the bottleneck in the supply chain and building independent barriers in niche semiconductor segments.

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