AI Server Power Supply
Industry
Adapter
Scheme Description
In adapter applications such as laptop chargers and electric‑vehicle chargers, the flyback topology has become the mainstream choice for low‑to‑medium power adapters, thanks to its simple structure, moderate cost, and inherent electrical isolation. A typical flyback architecture comprises AC input rectification and filtering, an RCD snubber, a primary‑side switching transistor, a high‑frequency transformer, and secondary‑side rectification and output filtering. Among these components, the selection of the primary‑side switching transistor and the secondary‑side rectifier directly determines the adapter’s conversion efficiency, thermal performance, and EMI characteristics.
Guangxin Chuangyu SiC Power Device Solutions:
To meet the design requirements of adapters for high voltage, high frequency, and high energy efficiency, Guangxin Chuangyu offers a synergistic solution combining SiC MOSFETs and SiC SBDs, covering the core power‑device positions in flyback topologies and delivering an energy‑efficiency leap for adapters—from “silicon‑based” to “silicon carbide.”
I. Topology Diagram Analysis: Application Locations of SiC Devices
Based on the flyback topology shown above, the application locations of SiC devices are as follows:
| Topological location | Device Type | Function Description |
| Primary-side main switching transistor | SiC MOSFET | The on-off switching of the primary current in the control transformer enables energy transfer and voltage conversion. The ultra-fast switching speed and low conduction losses of SiC MOSFETs significantly reduce both switching losses and conduction losses. |
| Secondary-side rectifier diode | SiC SBD | Rectify the transformer secondary-side induced voltage into a DC output. The SiC SBD exhibits zero reverse recovery charge (Qrr≈0), significantly reducing rectification losses and EMI noise. |
| RCD absorption/clamping | Optional SiC SBD | Absorbs leakage inductance energy, suppresses primary-side voltage spikes, and protects the switching transistor. |
|
Typical applications: AC INPUT → Rectifier Bridge → Input Filter → SiC MOSFET (Primary-Side Switch) → High-Frequency Transformer → SiC SBD (Secondary-Side Rectification) → Output Filter → DC OUTPUT (U+/U-) |
||
II. The Core Value of SiC MOSFETs in Adapters
Higher Efficiency: SiC MOSFETs feature extremely low on-state resistance (Rds(on)) and gate charge (Qg), significantly reducing conduction and switching losses in flyback topologies and enabling adapters to easily meet Energy Efficiency Level 6 or Level 7 standards.
Higher Frequency: Supports switching frequencies of up to 150 kHz or higher, effectively reducing the size of transformers and filter components, thereby enabling more compact and thinner adapter designs.
Lower EMI: Excellent body-diode reverse-recovery characteristics and fast switching speeds minimize oscillations and voltage spikes during switching. Combined with the zero reverse-recovery of SiC SBDs, this results in superior EMI performance.
High-Temperature Stability: SiC materials can withstand higher junction operating temperatures (175°C+), delivering more stable and reliable performance in sealed, high-temperature environments.
III. Summary of the Plan’s Value
| Dimension | Traditional silicon-based solution | Guangxin Chuangyu SiC Solution |
| Efficiency | Achieving the Level 6 or Level 7 energy efficiency standard is challenging. | Easily meets CET-6/CET-7 standards, with an efficiency of 94% or higher. |
| Frequency | Typically <65 kHz | Supports 150 kHz+, with transformer size reduced by 30%+ |
| EMI | Requires a complex absorption circuit. | The body diode exhibits excellent characteristics, with superior EMI performance. |
| Temperature rise | Significant heat generation; a large heatsink is required. | Low losses, low temperature rise, and simplified heat dissipation. |
| Reliability | Performance degradation at high temperatures | Stable operation at 175°C+, suitable for harsh environments. |
Solution Topology

Model Recommendations
|
No. |
Part No. |
VDSS |
Type |
ID(A) |
VGSS-OP |
VGS-TH (V) |
RDS(ON)(TJ=25℃) |
RDS(ON)(TJ=175℃) |
Package |
Product |
|||||
|
TC=25℃ |
TC=100℃ |
Min |
Type |
Max |
Type (mΩ) |
Max(mΩ) |
Type (mΩ) |
Max(mΩ) |
|||||||
|
1 |
GCC065N060D5EB |
750 |
N |
43 |
25 |
-5/18 |
2.5 |
3.1 |
3.4 |
56 |
60 |
80 |
- |
TO-220F |
SiC MOSFET |
|
2 |
GCC065M090D5EB |
650 |
N |
25 |
17.7 |
0/15 |
2.6 |
- |
4.6 |
90 |
120 |
82 |
- |
TO-220F |
SiC MOSFET |
|
3 |
GCC065M100F3EB |
750 |
N |
31.9 |
22.6 |
0/18 |
2.6 |
- |
4.6 |
100 |
130 |
98 |
- |
TO-247-3 |
SiC MOSFET |
|
4 |
GCC065M100D5EB |
750 |
N |
20.1 |
14.1 |
0/18 |
2.6 |
- |
4.6 |
100 |
130 |
98 |
- |
TO-220F |
SiC MOSFET |
|
5 |
GDC065M180E2FC |
650 |
N |
19 |
13.5 |
0/15 |
2.8 |
- |
3.9 |
187 |
215 |
175 |
- |
TO-252 |
SiC MOSFET |
|
6 |
GDC065M180D5FC |
650 |
N |
19 |
13.5 |
0/15 |
2.8 |
- |
3.9 |
187 |
215 |
175 |
- |
TO-220F |
SiC MOSFET |
|
7 |
GDC065M260E2FC |
650 |
N |
15.5 |
11 |
0/15 |
2.9 |
- |
5 |
260 |
300 |
231 |
- |
TO-252 |
SiC MOSFET |
|
8 |
GDC065M260D5FC |
650 |
N |
15.5 |
11 |
0/15 |
2.9 |
- |
5 |
260 |
300 |
231 |
- |
TO-220F |
SiC MOSFET |
|
9 |
GDC065M380E2FC |
650 |
N |
10 |
7.5 |
0/15 |
2.5 |
- |
3.7 |
313 |
440 |
336 |
- |
TO-252 |
SiC MOSFET |
|
10 |
GDC065M380D5FC |
650 |
N |
10 |
7.5 |
0/15 |
2.5 |
- |
3.7 |
313 |
440 |
336 |
- |
TO-220F |
SiC MOSFET |
|
11 |
GDC065M480E2FC |
650 |
N |
8.8 |
6.8 |
0/15 |
2.7 |
- |
3.85 |
437 |
568 |
406 |
- |
TO-252 |
SiC MOSFET |
|
12 |
GDC065M480D5FC |
650 |
N |
8.8 |
6.8 |
0/15 |
2.7 |
- |
3.8 |
437 |
568 |
406 |
- |
TO-220F |
SiC MOSFET |
|
13 |
GDC065M600E2FC |
650 |
N |
7 |
5.7 |
0/15 |
2.7 |
- |
3.8 |
500 |
650 |
509 |
- |
TO-252 |
SiC MOSFET |
|
14 |
GDC065M600D5FC |
650 |
N |
7 |
5.7 |
0/15 |
2.7 |
- |
3.8 |
500 |
650 |
509 |
- |
TO-220F |
SiC MOSFET |
|
15 |
GCC065M1K0E2FC |
650 |
N |
6 |
4 |
0/18 |
2.7 |
- |
4.5 |
1000 |
1250 |
773 |
- |
TO-252 |
SiC MOSFET |
|
16 |
GCC065M1K0D5FC |
650 |
N |
4.8 |
3.4 |
0/18 |
2.7 |
- |
4.5 |
1000 |
1300 |
773 |
- |
TO-220F |
SiC MOSFET |
Model Recommendations
|
No. |
Part No. |
VDSS |
Type |
ID(A) |
Vth |
RDS(ON) TJ= 25℃ |
Package |
Product |
||||
|
TC=25℃ |
TC=100℃ |
Min |
Type |
Max |
Type (mΩ) |
Max(mΩ) |
||||||
|
1 |
GDS060J600E2BC |
600 |
N |
8 |
5.1 |
2.5 |
3.5 |
4.5 |
528 |
600 |
TO-252 |
SJ MOSFET |
|
2 |
GDS060J600D5BC |
600 |
N |
8 |
5 |
2.5 |
3.5 |
4.5 |
528 |
600 |
TO-220F |
SJ MOSFET |
|
3 |
GDS060J380E2BC |
600 |
N |
11 |
6.9 |
2 |
3 |
4 |
330 |
380 |
TO-252 |
SJ MOSFET |
|
4 |
GDS060J380D5BC |
600 |
N |
11 |
6.9 |
2 |
3 |
4 |
330 |
380 |
TO-220F |
SJ MOSFET |
|
5 |
GDS070J380D5BC |
700 |
N |
10.6 |
6.7 |
2 |
3 |
4 |
340 |
380 |
TO-220F |
SJ MOSFET |
|
6 |
GDS060R190D5BC |
600 |
N |
20 |
12.6 |
3 |
4 |
5 |
165 |
190 |
TO-220F |
SJ MOSFET |
|
7 |
GDS060S170E2EC |
600 |
N |
19 |
11.2 |
2.5 |
3.5 |
4.5 |
151 |
170 |
TO-252 |
SJ MOSFET |
|
8 |
GDS060S170D5EC |
600 |
N |
19 |
11.2 |
2.5 |
3.5 |
4.5 |
151 |
170 |
TO-220F |
SJ MOSFET |
|
9 |
GDS060J120D5EC |
600 |
N |
26 |
16.5 |
2.5 |
3.5 |
4.5 |
108 |
120 |
TO-220F |
SJ MOSFET |
|
10 |
GDS060R090D5EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TO-220F |
SJ MOSFET |
|
11 |
GDS060R090C2EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TO-263 |
SJ MOSFET |
|
12 |
GDS060R090T8EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TOLL-8 |
SJ MOSFET |
|
13 |
GDS060R070D5EC |
600 |
N |
44 |
27.7 |
3 |
4 |
5 |
63 |
70 |
TO-220F |
SJ MOSFET |
|
14 |
GDS065S380D5BC |
650 |
N |
10.6 |
6.7 |
2.5 |
3.5 |
4.5 |
334 |
380 |
TO-220F |
SJ MOSFET |
|
15 |
GDS065S380E2BC |
650 |
N |
10.6 |
6.7 |
2.5 |
3.5 |
4.5 |
334 |
380 |
TO-252 |
SJ MOSFET |
|
16 |
GDS065S280E2BC |
650 |
N |
13.8 |
8.7 |
2.5 |
3.5 |
4.5 |
246 |
280 |
TO-252 |
SJ MOSFET |
|
17 |
GDS065S280D5BC |
650 |
N |
13.8 |
8.7 |
2.5 |
3.5 |
4.5 |
246 |
280 |
TO-220F |
SJ MOSFET |
|
18 |
GDS065J190D5EC |
650 |
N |
18 |
11.3 |
2.5 |
3.5 |
4.5 |
169 |
190 |
TO-220F |
SJ MOSFET |
Technical Communication
Scan the QR code to follow and communicate.
Product Inquiry:
130 3889 3770
Email:
Headquarters Address:
18th Floor, Building B, Gaoke Jinhui Tower, High-Tech Industrial Development Zone, Xuzhou City, Jiangsu Province
Sales Center Address:
24th Floor, Building A, Phoenix Smart Valley, Xixiang Subdistrict, Bao’an District, Shenzhen, Guangdong Province
WeChat Account
Douyin
© GXCY SEMICONDUCTOR (JIANGSU) CO., LTD. All Rights Reserved.