TV Power Supply

Scheme Description


In the design of power supplies for flat-panel TVs, the flyback topology has become the mainstream choice for low- and medium‑power applications, thanks to its simple structure, moderate cost, and inherent electrical isolation. A typical TV power supply comprises stages such as AC input rectification and filtering, a PFC stage, a primary‑side switching transistor, a high‑frequency transformer, and secondary‑side rectification and output filtering. It must simultaneously deliver a main‑voltage output (12 V/24 V, for the motherboard and backlight system) and a standby voltage output (5 V, for MCU control). Among these components, the selection of the primary‑side switching transistor and the secondary‑side rectifier directly impacts the power supply’s conversion efficiency, thermal performance, and standby power consumption.

Guangxin Chuangyu SiC Power Device Solutions:

To meet the design requirements of TV power supplies for high efficiency, high reliability, and low standby power consumption, Guangxin Chuangyu offers a synergistic SiC MOSFET–SiC SBD solution that covers the core power‑device positions in TV power supplies, helping to achieve higher efficiency, a more compact footprint, and longer service life.

 

I. Topology Diagram Analysis: Application Locations of SiC Devices

Based on the TV power‑supply topology shown above, the SiC devices are implemented at the following locations:

Topological location Device Type Function Description
PFC-class switching transistor SiC MOSFET Power factor correction reduces input current harmonics and complies with harmonic current limit standards.
PFC-class boost diode SiC SBD Zero reverse recovery, reducing switching losses and EMI noise in the PFC stage.
Primary-side main switching transistor SiC MOSFET By switching the primary current of the control transformer on and off, energy transfer and voltage conversion are achieved; the ultra‑fast switching speed of SiC MOSFETs significantly reduces switching losses.
Main output secondary-side rectifier diode SiC SBD (The figure shows a standard diode; upgrading is recommended) The secondary-side induced voltage of the transformer is rectified to produce a 12 V/24 V main output, and the zero reverse-recovery characteristics of the SiC SBD significantly reduce rectification losses.
Standby output secondary-side rectifier diode SiC SBD (The figure shows a standard diode; upgrading is recommended) Standby 5V output rectification reduces standby power consumption and meets energy efficiency standards.
Output-side linear regulator (78LXX) — Stabilize the standby voltage at 5 V for MCU use (the original scheme can be retained).
Typical applications:
AC INPUT → Rectifier Bridge → PFC Stage (SiC MOSFET + SiC SBD) → High-Voltage Bus → Flyback Primary Side (SiC MOSFET) → High-Frequency Transformer → Secondary-Side Rectification (SiC SBD) → 12V/24V Main Output (SYSTEM) + 5V Standby Output (MCU)

 

II. The Core Value of SiC Devices in TV Power Supplies

Higher Efficiency: The SiC MOSFET’s extremely low on‑resistance and gate charge, combined with the SiC SBD’s zero reverse recovery, significantly reduce losses in the PFC stage, the primary‑side switching stage, and the secondary‑side rectification stage, thereby improving overall power‑supply efficiency and helping meet energy‑efficiency standards.

Lower Standby Power Consumption: The zero reverse recovery characteristics of SiC SBDs effectively reduce rectification losses in standby mode, and when combined with an optimized standby control strategy, help TV power supplies meet stringent standby power‑consumption standards (<0.5 W).

Higher power density: Supports higher switching frequencies, effectively reducing the size of transformers, inductors, and output filter capacitors, enabling ultra-thin, compact TV power‑supply designs that fit the tight spaces of flat‑panel TVs.

Lower EMI: The zero reverse recovery characteristics of SiC SBDs significantly reduce switching ringing and high-frequency noise. Combined with the fast switching of SiC MOSFETs, this delivers superior EMI performance and simplifies filter circuit design.

Longer lifespan: SiC materials can withstand higher junction operating temperatures (175°C+), delivering more stable performance in the high‑temperature, enclosed environment of TV power supplies and extending the overall service life of the television.

 

III. Summary of the Plan’s Value

Dimension Traditional silicon-based solutions Guangxin Chuangyu SiC Solution
Efficiency Efficiency improvements are difficult, and losses are significant. Efficiency can exceed 94%, significantly reducing power consumption.
Standby power consumption Standby power consumption is relatively high. SiC SBDs feature zero reverse recovery, resulting in lower standby power consumption.
Frequency Typically <65 kHz Supports higher frequencies, with reduced magnetic component size.
EMI Requires a complex absorption circuit. SiC SBDs exhibit zero reverse recovery, resulting in superior EMI performance.
Temperature rise Significant heat generation requires a large heatsink. Low losses, low temperature rise, and simplified heat dissipation.
Lifespan Performance degradation at high temperatures Stable operation at 175°C+, extending the overall machine lifespan.

Solution Topology


Model Recommendations


No.

Part No.

VDSS
(V)

Type

ID(A)

VGSS-OP
(V)

VGS-TH (V)

RDS(ON)(TJ=25℃)

RDS(ON)(TJ=175℃)

Package

Product

TC=25℃

TC=100℃

Min

Type

Max

Type

(mΩ)

Max

(mΩ)

Type

(mΩ)

Max

(mΩ)

1

GCC065N020F3EB

650

N

120

100

0/18

2.7

-

4.5

20

26

23

-

TO-247-3

SiC MOSFET

2

GCC065N020F4EB

650

N

120

100

0/18

2.7

-

4.5

20

26

23

 

TO-247-4

SiC MOSFET

3

GCC065N040F3EB

750

N

68

48

-5/18

2.5

3.1

3.9

36

47

46

 

TO-247-3

SiC MOSFET

4

GCC065N040F4EB

750

N

68

48

-5/18

2.5

3.1

3.9

36

47

46

-

TO-247-4

SiC MOSFET

5

GCC065N060D5EB

750

N

43

25

-5/18

2.5

3.1

3.4

56

60

80

-

TO-220F

SiC MOSFET

6

GCC065N060F3EB

750

N

43

25

-5/18

2.5

3.1

3.4

56

60

80

 

TO-247-3

SiC MOSFET

7

GCC065M090F3EB

650

N

36

27

0/18

2.7

-

4.5

90

120

77

-

TO-247-3

SiC MOSFET

8

GCC065M090D5EB

650

N

25

17.7

0/15

2.6

-

4.6

90

120

82

-

TO-220F

SiC MOSFET

9

GCC065M100F3EB

750

N

31.9

22.6

0/18

2.6

-

4.6

100

130

98

-

TO-247-3

SiC MOSFET

10

GCC065M100D5EB

750

N

20.1

14.1

0/18

2.6

-

4.6

100

130

98

-

TO-220F

SiC MOSFET

11

GDC065M180E2FC

650

N

19

13.5

0/15

2.8

-

3.9

187

215

175

-

TO-252

SiC MOSFET

12

GDC065M180D5FC

650

N

19

13.5

0/15

2.8

-

3.9

187

215

175

-

TO-220F

SiC MOSFET

13

GDC065M260E2FC

650

N

15.5

11

0/15

2.9

-

5

260

300

231

-

TO-252

SiC MOSFET

14

GDC065M260D5FC

650

N

15.5

11

0/15

2.9

-

5

260

300

231

-

TO-220F

SiC MOSFET

15

GDC065M380E2FC

650

N

10

7.5

0/15

2.5

-

3.7

313

440

336

-

TO-252

SiC MOSFET

16

GDC065M380D5FC

650

N

10

7.5

0/15

2.5

-

3.7

313

440

336

-

TO-220F

SiC MOSFET

17

GDC065M480E2FC

650

N

8.8

6.8

0/15

2.7

-

3.85

437

568

406

-

TO-252

SiC MOSFET

18

GDC065M480D5FC

650

N

8.8

6.8

0/15

2.7

-

3.8

437

568

406

-

TO-220F

SiC MOSFET

19

GDC065M600E2FC

650

N

7

5.7

0/15

2.7

-

3.8

500

650

509

-

TO-252

SiC MOSFET

20

GDC065M600D5FC

650

N

7

5.7

0/15

2.7

-

3.8

500

650

509

-

TO-220F

SiC MOSFET

21

GCC065M1K0E2FC

650

N

6

4

0/18

2.7

-

4.5

1000

1250

773

-

TO-252

SiC MOSFET

22

GCC065M1K0D5FC

650

N

4.8

3.4

0/18

2.7

-

4.5

1000

1300

773

-

TO-220F

SiC MOSFET

23

GDC075N026F3EB

750

N

72

51

-5/18

2

2.96

4

26.2

34.1

33.6

-

TO-247-3

SiC MOSFET

Model Recommendations


No.

Part No.

VDSS
(V)

Type

ID(A)

Vth

RDS(ON) TJ= 25℃

Package

Product

TC=25℃

TC=100℃

Min

Type

Max

Type (mΩ)

Max(mΩ)

1

GDS060J600E2BC

600

N

8

5.1

2.5

3.5

4.5

528

600

TO-252

SJ MOSFET

2

GDS060J600D5BC

600

N

8

5

2.5

3.5

4.5

528

600

TO-220F

SJ MOSFET

3

GDS060J380E2BC

600

N

11

6.9

2

3

4

330

380

TO-252

SJ MOSFET

4

GDS060J380D5BC

600

N

11

6.9

2

3

4

330

380

TO-220F

SJ MOSFET

5

GDS070J380D5BC

700

N

10.6

6.7

2

3

4

340

380

TO-220F

SJ MOSFET

6

GDS060R190D5BC

600

N

20

12.6

3

4

5

165

190

TO-220F

SJ MOSFET

7

GDS060S170E2EC

600

N

19

11.2

2.5

3.5

4.5

151

170

TO-252

SJ MOSFET

8

GDS060S170D5EC

600

N

19

11.2

2.5

3.5

4.5

151

170

TO-220F

SJ MOSFET

9

GDS060J120D5EC

600

N

26

16.5

2.5

3.5

4.5

108

120

TO-220F

SJ MOSFET

10

GDS060J120F3EC

600

N

26

16.5

2.5

3.5

4.5

108

120

TO-247-3

SJ MOSFET

11

GDS060R090D5EC

600

N

31

20

3

4

5

86

99

TO-220F

SJ MOSFET

12

GDS060R090C2EC

600

N

31

20

3

4

5

86

99

TO-263

SJ MOSFET

13

GDS060R090F3EC

600

N

31

20

3

4

5

86

99

TO-247-3

SJ MOSFET

14

GDS060R090T8EC

600

N

31

20

3

4

5

86

99

TOLL-8

SJ MOSFET

15

GDS060R070D5EC

600

N

44

27.7

3

4

5

63

70

TO-220F

SJ MOSFET

16

GDS060R070F3EC

600

N

44

27.7

3

4

5

63

70

TO-247-3

SJ MOSFET

17

GDS060R038F3EC

600

N

52

32.8

3

4

5

34

38

TO-247-3

SJ MOSFET

18

GDS060R022F3EC

600

N

110

69.5

3

4

5

21

22

TO-247-3

SJ MOSFET

19

GDS065S380D5BC

650

N

10.6

6.7

2.5

3.5

4.5

334

380

TO-220F

SJ MOSFET

20

GDS065S380E2BC

650

N

10.6

6.7

2.5

3.5

4.5

334

380

TO-252

SJ MOSFET

21

GDS065S280E2BC

650

N

13.8

8.7

2.5

3.5

4.5

246

280

TO-252

SJ MOSFET

22

GDS065S280D5BC

650

N

13.8

8.7

2.5

3.5

4.5

246

280

TO-220F

SJ MOSFET

23

GDS065J190D5EC

650

N

18

11.3

2.5

3.5

4.5

169

190

TO-220F

SJ MOSFET

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