PC Power Supply

Scheme Description


In high‑end PC power supplies—particularly those certified 80 PLUS Titanium or Platinum—two mainstream DC‑DC conversion topologies are the dual‑transistor forward converter and the half‑bridge LLC resonant converter. The dual‑transistor forward topology is simple and highly reliable, making it well suited for medium‑ to high‑power applications. By contrast, the half‑bridge LLC resonant topology achieves extremely low switching losses through zero‑voltage/zero‑current switching (ZVS/ZCS), making it the preferred choice for designs emphasizing high efficiency and high power density. Both topologies require the use of high‑performance power devices at the primary‑side switch and the secondary‑side rectifier positions to overcome the efficiency limitations inherent in conventional silicon‑based solutions.

Guangxin Chuangyu SiC Power Device Solutions:

To meet the design requirements of PC power supplies—high energy efficiency, high power density, and low standby power consumption—Guangxin Chuangyu offers a synergistic SiC MOSFET + SiC SBD solution that covers the critical power‑device positions in both the dual‑transistor forward converter and the half‑bridge LLC topology, helping PC power supplies easily achieve 80 PLUS Titanium certification.

 

I. Topology Diagram Analysis: Application Locations of SiC Devices

1. Dual-Transistor Forward Topology

Topological location Device Type Function Description
PFC-class switching transistor SiC MOSFET Power factor correction to reduce input current harmonics.
PFC-class boost diode SiC SBD Zero reverse recovery, reducing switching losses and EMI in the PFC stage.
Dual‑switch forward converter primary-side switching transistors (2 units) SiC MOSFET Controlling energy transfer on the primary side of the transformer, the ultra-fast switching speed of the SiC MOSFET significantly reduces switching losses.
Secondary-side rectifier diode SiC SBD Multi-output (+12V/+5V) rectification with zero reverse recovery characteristics significantly reduces rectification losses.

 

2. Half-Bridge LLC Resonant Topology

Topological location Device Type Function Description
PFC-class switching transistor SiC MOSFET Power factor correction to reduce input current harmonics.
PFC-class boost diode SiC SBD Zero reverse recovery, reducing losses and EMI in the PFC stage.
Half-bridge LLC primary-side switching transistors (2 units) SiC MOSFET It forms a half-bridge resonant network, and the SiC MOSFET’s excellent body-diode reverse-recovery characteristics perfectly match the ZVS soft-switching requirements of the LLC topology.
Secondary-side rectifier diode SiC SBD Multi‑output (+12 V/+5 V) rectification with zero reverse recovery, significantly reducing secondary‑side rectification losses.
Typical applications:
AC INPUT → Rectifier Bridge → PFC Stage (SiC MOSFET + SiC SBD) → High-Voltage Bus → Dual-Transistor Forward / Half-Bridge LLC (SiC MOSFET) → High-Frequency Transformer → Secondary-Side Rectification (SiC SBD) → +12V/+5V Outputs

 

II. The Core Value of SiC Devices in PC Power Supplies

Higher Efficiency: The SiC MOSFET’s extremely low on‑resistance and gate charge, combined with the SiC SBD’s zero reverse recovery, significantly reduce losses in the PFC stage, the primary‑side switching stage, and the secondary‑side rectification stage, enabling PC power supplies to easily achieve 80 PLUS Titanium efficiency (94%+).

Higher power density: Supports higher switching frequencies, effectively reducing the size of the PFC inductor, LLC transformer, and output filter capacitors, thereby enabling higher power output within a constrained footprint.

Lower EMI: The zero reverse recovery characteristics of SiC SBDs significantly reduce switching ringing and high-frequency noise. Combined with the fast switching of SiC MOSFETs, this delivers superior EMI performance and simplifies filter circuit design.

Higher reliability: SiC materials can withstand higher junction temperatures (175°C+), delivering more stable performance in the enclosed, high-temperature environment of PC power supplies and extending service life.

 

III. Summary of the Plan’s Value

Dimension Traditional silicon-based solution Guangxin Chuangyu SiC Solution
Efficiency Titanium-level certification is highly challenging. Easily meets the 80 PLUS Titanium standard (94%+ efficiency)
Frequency Typically <100 kHz Supports higher frequencies, with reduced magnetic component size.
EMI Requires a complex absorption circuit. SiC SBDs exhibit zero reverse recovery, resulting in superior EMI performance.
Temperature rise Significant heat generation; a large heatsink is required. Low losses, low temperature rise, and simplified heat dissipation.
Reliability Performance degradation at high temperatures Stable operation at 175°C+, suitable for harsh environments.

Solution Topology


Model Recommendations


NO.

Part No.

VDSS
(V)

Type

ID(A)

VGSS-OP
(V)

VGS-TH (V)

RDS(ON)(TJ=25℃)

RDS(ON)(TJ=175℃)

Package

Product

TC=25℃

TC=100℃

Min

Type

Max

Type

(mΩ)

Max

(mΩ)

Type

(mΩ)

Max

(mΩ)

1

GCC065N020F3EB

650

N

120

100

0/18

2.7

-

4.5

20

26

23

-

TO-247-3

SiC MOSFET

2

GCC065N020F4EB

650

N

120

100

0/18

2.7

-

4.5

20

26

23

 

TO-247-4

SiC MOSFET

3

GCC065N040F3EB

750

N

68

48

-5/18

2.5

3.1

3.9

36

47

46

 

TO-247-3

SiC MOSFET

4

GCC065N040F4EB

750

N

68

48

-5/18

2.5

3.1

3.9

36

47

46

-

TO-247-4

SiC MOSFET

5

GCC065N060D5EB

750

N

43

25

-5/18

2.5

3.1

3.4

56

60

80

-

TO-220F

SiC MOSFET

6

GCC065N060F3EB

750

N

43

25

-5/18

2.5

3.1

3.4

56

60

80

 

TO-247-3

SiC MOSFET

7

GCC065M090F3EB

650

N

36

27

0/18

2.7

-

4.5

90

120

77

-

TO-247-3

SiC MOSFET

8

GCC065M090D5EB

650

N

25

17.7

0/15

2.6

-

4.6

90

120

82

-

TO-220F

SiC MOSFET

9

GCC065M100F3EB

750

N

31.9

22.6

0/18

2.6

-

4.6

100

130

98

-

TO-247-3

SiC MOSFET

10

GCC065M100D5EB

750

N

20.1

14.1

0/18

2.6

-

4.6

100

130

98

-

TO-220F

SiC MOSFET

11

GDC065M180E2FC

650

N

19

13.5

0/15

2.8

-

3.9

187

215

175

-

TO-252

SiC MOSFET

12

GDC065M180D5FC

650

N

19

13.5

0/15

2.8

-

3.9

187

215

175

-

TO-220F

SiC MOSFET

13

GDC065M260E2FC

650

N

15.5

11

0/15

2.9

-

5

260

300

231

-

TO-252

SiC MOSFET

14

GDC065M260D5FC

650

N

15.5

11

0/15

2.9

-

5

260

300

231

-

TO-220F

SiC MOSFET

15

GDC065M380E2FC

650

N

10

7.5

0/15

2.5

-

3.7

313

440

336

-

TO-252

SiC MOSFET

16

GDC065M380D5FC

650

N

10

7.5

0/15

2.5

-

3.7

313

440

336

-

TO-220F

SiC MOSFET

17

GDC065M480E2FC

650

N

8.8

6.8

0/15

2.7

-

3.85

437

568

406

-

TO-252

SiC MOSFET

18

GDC065M480D5FC

650

N

8.8

6.8

0/15

2.7

-

3.8

437

568

406

-

TO-220F

SiC MOSFET

19

GDC065M600E2FC

650

N

7

5.7

0/15

2.7

-

3.8

500

650

509

-

TO-252

SiC MOSFET

20

GDC065M600D5FC

650

N

7

5.7

0/15

2.7

-

3.8

500

650

509

-

TO-220F

SiC MOSFET

21

GCC065M1K0E2FC

650

N

6

4

0/18

2.7

-

4.5

1000

1250

773

-

TO-252

SiC MOSFET

22

GCC065M1K0D5FC

650

N

4.8

3.4

0/18

2.7

-

4.5

1000

1300

773

-

TO-220F

SiC MOSFET

23

GDC075N026F3EB

750

N

72

51

-5/18

2

2.96

4

26.2

34.1

33.6

-

TO-247-3

SiC MOSFET

Model Recommendations


No.

Part No.

VDSS
(V)

Type

ID(A)

Vth

RDS(ON) TJ= 25℃

Package

Product

TC=25℃

TC=100℃

Min

Type

Max

Type (mΩ)

Max(mΩ)

1

GDS060J600E2BC

600

N

8

5.1

2.5

3.5

4.5

528

600

TO-252

SJ MOSFET

2

GDS060J600D5BC

600

N

8

5

2.5

3.5

4.5

528

600

TO-220F

SJ MOSFET

3

GDS060J380E2BC

600

N

11

6.9

2

3

4

330

380

TO-252

SJ MOSFET

4

GDS060J380D5BC

600

N

11

6.9

2

3

4

330

380

TO-220F

SJ MOSFET

5

GDS070J380D5BC

700

N

10.6

6.7

2

3

4

340

380

TO-220F

SJ MOSFET

6

GDS060R190D5BC

600

N

20

12.6

3

4

5

165

190

TO-220F

SJ MOSFET

7

GDS060S170E2EC

600

N

19

11.2

2.5

3.5

4.5

151

170

TO-252

SJ MOSFET

8

GDS060S170D5EC

600

N

19

11.2

2.5

3.5

4.5

151

170

TO-220F

SJ MOSFET

9

GDS060J120D5EC

600

N

26

16.5

2.5

3.5

4.5

108

120

TO-220F

SJ MOSFET

10

GDS060J120F3EC

600

N

26

16.5

2.5

3.5

4.5

108

120

TO-247-3

SJ MOSFET

11

GDS060R090D5EC

600

N

31

20

3

4

5

86

99

TO-220F

SJ MOSFET

12

GDS060R090C2EC

600

N

31

20

3

4

5

86

99

TO-263

SJ MOSFET

13

GDS060R090F3EC

600

N

31

20

3

4

5

86

99

TO-247-3

SJ MOSFET

14

GDS060R090T8EC

600

N

31

20

3

4

5

86

99

TOLL-8

SJ MOSFET

15

GDS060R070D5EC

600

N

44

27.7

3

4

5

63

70

TO-220F

SJ MOSFET

16

GDS060R070F3EC

600

N

44

27.7

3

4

5

63

70

TO-247-3

SJ MOSFET

17

GDS060R038F3EC

600

N

52

32.8

3

4

5

34

38

TO-247-3

SJ MOSFET

18

GDS060R022F3EC

600

N

110

69.5

3

4

5

21

22

TO-247-3

SJ MOSFET

19

GDS065S380D5BC

650

N

10.6

6.7

2.5

3.5

4.5

334

380

TO-220F

SJ MOSFET

20

GDS065S380E2BC

650

N

10.6

6.7

2.5

3.5

4.5

334

380

TO-252

SJ MOSFET

21

GDS065S280E2BC

650

N

13.8

8.7

2.5

3.5

4.5

246

280

TO-252

SJ MOSFET

22

GDS065S280D5BC

650

N

13.8

8.7

2.5

3.5

4.5

246

280

TO-220F

SJ MOSFET

23

GDS065J190D5EC

650

N

18

11.3

2.5

3.5

4.5

169

190

TO-220F

SJ MOSFET

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