AI Server Power Supply
Industry
PC Power Supply
Scheme Description
In high‑end PC power supplies—particularly those certified 80 PLUS Titanium or Platinum—two mainstream DC‑DC conversion topologies are the dual‑transistor forward converter and the half‑bridge LLC resonant converter. The dual‑transistor forward topology is simple and highly reliable, making it well suited for medium‑ to high‑power applications. By contrast, the half‑bridge LLC resonant topology achieves extremely low switching losses through zero‑voltage/zero‑current switching (ZVS/ZCS), making it the preferred choice for designs emphasizing high efficiency and high power density. Both topologies require the use of high‑performance power devices at the primary‑side switch and the secondary‑side rectifier positions to overcome the efficiency limitations inherent in conventional silicon‑based solutions.
Guangxin Chuangyu SiC Power Device Solutions:
To meet the design requirements of PC power supplies—high energy efficiency, high power density, and low standby power consumption—Guangxin Chuangyu offers a synergistic SiC MOSFET + SiC SBD solution that covers the critical power‑device positions in both the dual‑transistor forward converter and the half‑bridge LLC topology, helping PC power supplies easily achieve 80 PLUS Titanium certification.
I. Topology Diagram Analysis: Application Locations of SiC Devices
1. Dual-Transistor Forward Topology
| Topological location | Device Type | Function Description |
| PFC-class switching transistor | SiC MOSFET | Power factor correction to reduce input current harmonics. |
| PFC-class boost diode | SiC SBD | Zero reverse recovery, reducing switching losses and EMI in the PFC stage. |
| Dual‑switch forward converter primary-side switching transistors (2 units) | SiC MOSFET | Controlling energy transfer on the primary side of the transformer, the ultra-fast switching speed of the SiC MOSFET significantly reduces switching losses. |
| Secondary-side rectifier diode | SiC SBD | Multi-output (+12V/+5V) rectification with zero reverse recovery characteristics significantly reduces rectification losses. |
2. Half-Bridge LLC Resonant Topology
| Topological location | Device Type | Function Description |
| PFC-class switching transistor | SiC MOSFET | Power factor correction to reduce input current harmonics. |
| PFC-class boost diode | SiC SBD | Zero reverse recovery, reducing losses and EMI in the PFC stage. |
| Half-bridge LLC primary-side switching transistors (2 units) | SiC MOSFET | It forms a half-bridge resonant network, and the SiC MOSFET’s excellent body-diode reverse-recovery characteristics perfectly match the ZVS soft-switching requirements of the LLC topology. |
| Secondary-side rectifier diode | SiC SBD | Multi‑output (+12 V/+5 V) rectification with zero reverse recovery, significantly reducing secondary‑side rectification losses. |
| Typical applications: AC INPUT → Rectifier Bridge → PFC Stage (SiC MOSFET + SiC SBD) → High-Voltage Bus → Dual-Transistor Forward / Half-Bridge LLC (SiC MOSFET) → High-Frequency Transformer → Secondary-Side Rectification (SiC SBD) → +12V/+5V Outputs |
||
II. The Core Value of SiC Devices in PC Power Supplies
Higher Efficiency: The SiC MOSFET’s extremely low on‑resistance and gate charge, combined with the SiC SBD’s zero reverse recovery, significantly reduce losses in the PFC stage, the primary‑side switching stage, and the secondary‑side rectification stage, enabling PC power supplies to easily achieve 80 PLUS Titanium efficiency (94%+).
Higher power density: Supports higher switching frequencies, effectively reducing the size of the PFC inductor, LLC transformer, and output filter capacitors, thereby enabling higher power output within a constrained footprint.
Lower EMI: The zero reverse recovery characteristics of SiC SBDs significantly reduce switching ringing and high-frequency noise. Combined with the fast switching of SiC MOSFETs, this delivers superior EMI performance and simplifies filter circuit design.
Higher reliability: SiC materials can withstand higher junction temperatures (175°C+), delivering more stable performance in the enclosed, high-temperature environment of PC power supplies and extending service life.
III. Summary of the Plan’s Value
| Dimension | Traditional silicon-based solution | Guangxin Chuangyu SiC Solution |
| Efficiency | Titanium-level certification is highly challenging. | Easily meets the 80 PLUS Titanium standard (94%+ efficiency) |
| Frequency | Typically <100 kHz | Supports higher frequencies, with reduced magnetic component size. |
| EMI | Requires a complex absorption circuit. | SiC SBDs exhibit zero reverse recovery, resulting in superior EMI performance. |
| Temperature rise | Significant heat generation; a large heatsink is required. | Low losses, low temperature rise, and simplified heat dissipation. |
| Reliability | Performance degradation at high temperatures | Stable operation at 175°C+, suitable for harsh environments. |
Solution Topology

Model Recommendations
|
NO. |
Part No. |
VDSS |
Type |
ID(A) |
VGSS-OP |
VGS-TH (V) |
RDS(ON)(TJ=25℃) |
RDS(ON)(TJ=175℃) |
Package |
Product |
|||||
|
TC=25℃ |
TC=100℃ |
Min |
Type |
Max |
Type (mΩ) |
Max (mΩ) |
Type (mΩ) |
Max (mΩ) |
|||||||
|
1 |
GCC065N020F3EB |
650 |
N |
120 |
100 |
0/18 |
2.7 |
- |
4.5 |
20 |
26 |
23 |
- |
TO-247-3 |
SiC MOSFET |
|
2 |
GCC065N020F4EB |
650 |
N |
120 |
100 |
0/18 |
2.7 |
- |
4.5 |
20 |
26 |
23 |
|
TO-247-4 |
SiC MOSFET |
|
3 |
GCC065N040F3EB |
750 |
N |
68 |
48 |
-5/18 |
2.5 |
3.1 |
3.9 |
36 |
47 |
46 |
|
TO-247-3 |
SiC MOSFET |
|
4 |
GCC065N040F4EB |
750 |
N |
68 |
48 |
-5/18 |
2.5 |
3.1 |
3.9 |
36 |
47 |
46 |
- |
TO-247-4 |
SiC MOSFET |
|
5 |
GCC065N060D5EB |
750 |
N |
43 |
25 |
-5/18 |
2.5 |
3.1 |
3.4 |
56 |
60 |
80 |
- |
TO-220F |
SiC MOSFET |
|
6 |
GCC065N060F3EB |
750 |
N |
43 |
25 |
-5/18 |
2.5 |
3.1 |
3.4 |
56 |
60 |
80 |
|
TO-247-3 |
SiC MOSFET |
|
7 |
GCC065M090F3EB |
650 |
N |
36 |
27 |
0/18 |
2.7 |
- |
4.5 |
90 |
120 |
77 |
- |
TO-247-3 |
SiC MOSFET |
|
8 |
GCC065M090D5EB |
650 |
N |
25 |
17.7 |
0/15 |
2.6 |
- |
4.6 |
90 |
120 |
82 |
- |
TO-220F |
SiC MOSFET |
|
9 |
GCC065M100F3EB |
750 |
N |
31.9 |
22.6 |
0/18 |
2.6 |
- |
4.6 |
100 |
130 |
98 |
- |
TO-247-3 |
SiC MOSFET |
|
10 |
GCC065M100D5EB |
750 |
N |
20.1 |
14.1 |
0/18 |
2.6 |
- |
4.6 |
100 |
130 |
98 |
- |
TO-220F |
SiC MOSFET |
|
11 |
GDC065M180E2FC |
650 |
N |
19 |
13.5 |
0/15 |
2.8 |
- |
3.9 |
187 |
215 |
175 |
- |
TO-252 |
SiC MOSFET |
|
12 |
GDC065M180D5FC |
650 |
N |
19 |
13.5 |
0/15 |
2.8 |
- |
3.9 |
187 |
215 |
175 |
- |
TO-220F |
SiC MOSFET |
|
13 |
GDC065M260E2FC |
650 |
N |
15.5 |
11 |
0/15 |
2.9 |
- |
5 |
260 |
300 |
231 |
- |
TO-252 |
SiC MOSFET |
|
14 |
GDC065M260D5FC |
650 |
N |
15.5 |
11 |
0/15 |
2.9 |
- |
5 |
260 |
300 |
231 |
- |
TO-220F |
SiC MOSFET |
|
15 |
GDC065M380E2FC |
650 |
N |
10 |
7.5 |
0/15 |
2.5 |
- |
3.7 |
313 |
440 |
336 |
- |
TO-252 |
SiC MOSFET |
|
16 |
GDC065M380D5FC |
650 |
N |
10 |
7.5 |
0/15 |
2.5 |
- |
3.7 |
313 |
440 |
336 |
- |
TO-220F |
SiC MOSFET |
|
17 |
GDC065M480E2FC |
650 |
N |
8.8 |
6.8 |
0/15 |
2.7 |
- |
3.85 |
437 |
568 |
406 |
- |
TO-252 |
SiC MOSFET |
|
18 |
GDC065M480D5FC |
650 |
N |
8.8 |
6.8 |
0/15 |
2.7 |
- |
3.8 |
437 |
568 |
406 |
- |
TO-220F |
SiC MOSFET |
|
19 |
GDC065M600E2FC |
650 |
N |
7 |
5.7 |
0/15 |
2.7 |
- |
3.8 |
500 |
650 |
509 |
- |
TO-252 |
SiC MOSFET |
|
20 |
GDC065M600D5FC |
650 |
N |
7 |
5.7 |
0/15 |
2.7 |
- |
3.8 |
500 |
650 |
509 |
- |
TO-220F |
SiC MOSFET |
|
21 |
GCC065M1K0E2FC |
650 |
N |
6 |
4 |
0/18 |
2.7 |
- |
4.5 |
1000 |
1250 |
773 |
- |
TO-252 |
SiC MOSFET |
|
22 |
GCC065M1K0D5FC |
650 |
N |
4.8 |
3.4 |
0/18 |
2.7 |
- |
4.5 |
1000 |
1300 |
773 |
- |
TO-220F |
SiC MOSFET |
|
23 |
GDC075N026F3EB |
750 |
N |
72 |
51 |
-5/18 |
2 |
2.96 |
4 |
26.2 |
34.1 |
33.6 |
- |
TO-247-3 |
SiC MOSFET |
Model Recommendations
|
No. |
Part No. |
VDSS |
Type |
ID(A) |
Vth |
RDS(ON) TJ= 25℃ |
Package |
Product |
||||
|
TC=25℃ |
TC=100℃ |
Min |
Type |
Max |
Type (mΩ) |
Max(mΩ) |
||||||
|
1 |
GDS060J600E2BC |
600 |
N |
8 |
5.1 |
2.5 |
3.5 |
4.5 |
528 |
600 |
TO-252 |
SJ MOSFET |
|
2 |
GDS060J600D5BC |
600 |
N |
8 |
5 |
2.5 |
3.5 |
4.5 |
528 |
600 |
TO-220F |
SJ MOSFET |
|
3 |
GDS060J380E2BC |
600 |
N |
11 |
6.9 |
2 |
3 |
4 |
330 |
380 |
TO-252 |
SJ MOSFET |
|
4 |
GDS060J380D5BC |
600 |
N |
11 |
6.9 |
2 |
3 |
4 |
330 |
380 |
TO-220F |
SJ MOSFET |
|
5 |
GDS070J380D5BC |
700 |
N |
10.6 |
6.7 |
2 |
3 |
4 |
340 |
380 |
TO-220F |
SJ MOSFET |
|
6 |
GDS060R190D5BC |
600 |
N |
20 |
12.6 |
3 |
4 |
5 |
165 |
190 |
TO-220F |
SJ MOSFET |
|
7 |
GDS060S170E2EC |
600 |
N |
19 |
11.2 |
2.5 |
3.5 |
4.5 |
151 |
170 |
TO-252 |
SJ MOSFET |
|
8 |
GDS060S170D5EC |
600 |
N |
19 |
11.2 |
2.5 |
3.5 |
4.5 |
151 |
170 |
TO-220F |
SJ MOSFET |
|
9 |
GDS060J120D5EC |
600 |
N |
26 |
16.5 |
2.5 |
3.5 |
4.5 |
108 |
120 |
TO-220F |
SJ MOSFET |
|
10 |
GDS060J120F3EC |
600 |
N |
26 |
16.5 |
2.5 |
3.5 |
4.5 |
108 |
120 |
TO-247-3 |
SJ MOSFET |
|
11 |
GDS060R090D5EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TO-220F |
SJ MOSFET |
|
12 |
GDS060R090C2EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TO-263 |
SJ MOSFET |
|
13 |
GDS060R090F3EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TO-247-3 |
SJ MOSFET |
|
14 |
GDS060R090T8EC |
600 |
N |
31 |
20 |
3 |
4 |
5 |
86 |
99 |
TOLL-8 |
SJ MOSFET |
|
15 |
GDS060R070D5EC |
600 |
N |
44 |
27.7 |
3 |
4 |
5 |
63 |
70 |
TO-220F |
SJ MOSFET |
|
16 |
GDS060R070F3EC |
600 |
N |
44 |
27.7 |
3 |
4 |
5 |
63 |
70 |
TO-247-3 |
SJ MOSFET |
|
17 |
GDS060R038F3EC |
600 |
N |
52 |
32.8 |
3 |
4 |
5 |
34 |
38 |
TO-247-3 |
SJ MOSFET |
|
18 |
GDS060R022F3EC |
600 |
N |
110 |
69.5 |
3 |
4 |
5 |
21 |
22 |
TO-247-3 |
SJ MOSFET |
|
19 |
GDS065S380D5BC |
650 |
N |
10.6 |
6.7 |
2.5 |
3.5 |
4.5 |
334 |
380 |
TO-220F |
SJ MOSFET |
|
20 |
GDS065S380E2BC |
650 |
N |
10.6 |
6.7 |
2.5 |
3.5 |
4.5 |
334 |
380 |
TO-252 |
SJ MOSFET |
|
21 |
GDS065S280E2BC |
650 |
N |
13.8 |
8.7 |
2.5 |
3.5 |
4.5 |
246 |
280 |
TO-252 |
SJ MOSFET |
|
22 |
GDS065S280D5BC |
650 |
N |
13.8 |
8.7 |
2.5 |
3.5 |
4.5 |
246 |
280 |
TO-220F |
SJ MOSFET |
|
23 |
GDS065J190D5EC |
650 |
N |
18 |
11.3 |
2.5 |
3.5 |
4.5 |
169 |
190 |
TO-220F |
SJ MOSFET |
Technical Communication
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Product Inquiry:
130 3889 3770
Email:
Headquarters Address:
18th Floor, Building B, Gaoke Jinhui Tower, High-Tech Industrial Development Zone, Xuzhou City, Jiangsu Province
Sales Center Address:
24th Floor, Building A, Phoenix Smart Valley, Xixiang Subdistrict, Bao’an District, Shenzhen, Guangdong Province
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