SiC Wafer Design & Fabrication Services

Guangxin Chuangyu Semiconductor specializes in the manufacturing of SiC power devices, offering industry‑leading process technologies and comprehensive technical support. With a thoroughly validated silicon carbide process library and IP portfolio, we are committed to fostering a nationwide compound semiconductor design ecosystem, providing a robust foundation that accelerates product development and mitigates mass‑production risks for our customers.

Our R&D team brings together seasoned experts from leading global semiconductor companies, with over 40 years of experience in chip design and industrialization. We master end-to-end core technologies, spanning device physics and design, process development, and module packaging. Leveraging our comprehensive IDM vertical integration capabilities, we offer customers flexible, professional custom power‑chip solutions that cover the entire value chain—from concept design to mass‑production delivery.

Whether in the fields of new energy, AI servers, or high‑voltage power conversion, we leverage our technological expertise and unwavering commitment to quality to help customers achieve differentiated innovation and seamless, efficient implementation.

ADVANTAGE

Competitive Advantage

Company Positioning	Guangxin Chuangyu Semiconductor is a company specializing in the design and sales of SiC chips, achieving end-to-end IDM vertical integration across the entire value chain—from substrate production and chip design to wafer fabrication, module packaging and testing, and final product sales.
Core product	650 V (trench gate, super-junction, JFET), 1200 V, 1700 V, 3300 V, 6600 V, and the planned 10 kV development.
Target market	Consumer electronics, new energy, AI servers, SSR solid-state relays/SST solid-state transformers/SSCB solid-state circuit breakers
Core Advantages	Differentiated technology roadmap	Leading adoption of advanced wafer processes: trench-gate + super-junction, super-junction, and JFET products.
		Ultra-high-voltage product ramp-up: mass production introduction of 1,700 V, 3,300 V, and 6,600 V products; development and introduction of 10 kV ultra-high-voltage products.
	Cost competitiveness	Promote IDM vertical integration to reduce costs.
		Wafer‑process cost reduction: adoption of trench‑gate + superjunction, superjunction, and 8‑inch wafers.
		The profit margin from the localization and introduction of ultra-high-voltage products drives overall cost reductions.
	The R&D team brings together experts from the world’s leading semiconductor companies, with over 40 years of experience in chip design and industrialization. Master the core technologies spanning chip-level physical design, process development, and module and device packaging.
	Extensive patent filings both domestically and internationally.
Company Mission	Through technological innovation, we are breaking through the limits of energy conversion efficiency.
We commit to our customers.	We provide products with stable performance and reliable quality.