AI Server Power Supply
Industry
Charging Pile Power Module
Scheme Description
In DC fast‑charging infrastructure for electric vehicles, the charging station’s power module serves as the core power‑conversion unit, efficiently transforming three‑phase AC grid power into a stable DC voltage required by the traction battery. A typical charging‑station power module employs a two‑stage architecture: AC‑DC (rectification plus PFC) followed by DC‑DC (isolated conversion). The front stage uses three‑phase rectification and power‑factor correction (PFC) to regulate a high‑voltage DC bus, while the rear stage provides an adjustable DC output via an isolated DC‑DC converter to charge the traction battery. In this architecture, the selection of the PFC switching devices, the primary‑side switches in the DC‑DC converter, and the secondary‑side rectifier diodes directly determines the module’s conversion efficiency, power density, and reliability.
Guangxin Chuangyu SiC Power Device Solutions:
To meet the design requirements of charging‑pile power modules—namely high power, high efficiency, and high power density—Guangxin Chuangyu offers a synergistic SiC MOSFET + SiC SBD solution that covers the critical power‑device positions in both the AC‑DC and DC‑DC stages, helping charging‑pile power modules achieve higher efficiency, smaller form factors, and longer lifetimes.
I. Topology Diagram Analysis: Application Locations of SiC Devices
Based on the power‑module topology of the charging station shown above, the SiC devices are implemented at the following locations:
| Topological location | Recommended Devices | Specification Requirements | Function Description |
| Three-phase rectifier bridge | 1200V SiC SBD | 1200V/10-40A | Rectifying three-phase AC into DC, the zero reverse-recovery characteristics of SiC SBDs significantly reduce rectification losses and EMI. |
| PFC-class switching transistor | 650V SiC MOSFET | 650V/10-80mΩ | Power factor correction reduces input current harmonics, while the ultra-fast switching speed of SiC MOSFETs significantly lowers switching losses. |
| DC-DC primary-side switching transistor | 650V SiC MOSFET | 650V/10-80mΩ | It forms the primary-side full-bridge/LLC inverter circuit, converting high-voltage DC into high-frequency AC to drive the transformer’s primary side. |
| DC-DC secondary-side rectifier diode | 650V SiC SBD | 650V/10-40A | The high-frequency AC on the transformer secondary side is rectified into a DC output, and the zero reverse-recovery characteristics of the SiC SBD significantly reduce rectification losses. |
| Typical applications: AC INPUT (Three-phase) → Rectifier Bridge (1200V SiC SBD) → PFC Stage (650V SiC MOSFET) → High-Voltage DC Bus → Primary-Side Inverter for DC-DC Conversion (650V SiC MOSFET) → High-Frequency Transformer → Secondary-Side Rectification (650V SiC SBD) → DC OUTPUT |
|||
II. The Core Value of SiC Devices in Charging Station Power Modules
Higher Efficiency: The SiC MOSFET’s extremely low on‑resistance and gate charge, combined with the SiC SBD’s zero reverse recovery, significantly reduce losses in the rectifier stage, PFC stage, primary‑side inverter stage, and secondary‑side rectifier stage, thereby boosting overall module efficiency (up to 96%+ ) and lowering operating costs.
Higher power density: Supports higher switching frequencies, effectively reducing the size of PFC inductors, transformers, and output filter capacitors, thereby enabling compact, high‑power‑density designs for charging‑station power modules and saving floor space.
Lower EMI: The zero reverse recovery characteristics of SiC SBDs significantly reduce switching ringing and high-frequency noise. Combined with the fast switching of SiC MOSFETs, this results in improved system EMI performance and simplifies filter circuit design.
Higher reliability: SiC materials can withstand higher junction operating temperatures (175°C+), delivering more stable performance in harsh outdoor conditions such as high temperature and high humidity, thereby extending the module’s service life.
Improved system cost: High efficiency reduces thermal management requirements, while higher switching frequencies enable smaller magnetic components, thereby lowering both the bill of materials (BOM) and operational maintenance costs.
III. Summary of the Plan’s Value
| Dimension | Traditional silicon-based solution | Guangxin Chuangyu SiC Solution |
| Efficiency | Efficiency improvements are difficult, and losses are significant. | Efficiency can exceed 96%, reducing operational costs. |
| Frequency | Typically <50 kHz | Supports higher frequencies, with reduced magnetic component size. |
| EMI | Requires a complex absorption circuit. | SiC SBDs exhibit zero reverse recovery, resulting in superior EMI performance. |
| Temperature rise | Significant heat generation requires a large heatsink. | Low losses, low temperature rise, and simplified heat dissipation. |
| Reliability | Performance degradation at high temperatures | Stable operation at 175°C+, suitable for harsh outdoor environments. |
| System cost | Heat dissipation and magnetic components are costly. | Comprehensive BOM cost reduction |
Solution Topology

Model Recommendations
|
No. |
Part No. |
VDSS |
Type |
ID(A) |
VGSS-OP |
VGS-TH (V) |
RDS(ON)(TJ=25℃) |
RDS(ON)(TJ=175℃) |
Package |
Product |
|||||
|
TC=25℃ |
TC=100℃ |
Min |
Type |
Max |
Type (mΩ) |
Max (mΩ) |
Type (mΩ) |
Max (mΩ) |
|||||||
|
1 |
GCC120N010F4EB |
1200 |
N |
113 |
80 |
-5/18 |
2 |
2.7 |
4 |
14.5 |
19 |
27 |
- |
TO-247-4 |
SiC MOSFET |
|
2 |
GCC120N030F3EB |
1200 |
N |
55 |
39 |
-5/18 |
2 |
- |
4 |
30 |
40 |
54 |
- |
TO-247-3 |
SiC MOSFET |
|
3 |
GCC120N030F4EB |
1200 |
N |
55 |
39 |
-5/18 |
2 |
- |
4 |
30 |
40 |
54 |
- |
TO-247-4 |
SiC MOSFET |
|
4 |
GCC120N035F3EB |
1200 |
N |
47 |
33 |
-5/18 |
2 |
- |
4 |
35 |
45 |
65 |
- |
TO-247-3 |
SiC MOSFET |
|
5 |
GCC120N035F4EB |
1200 |
N |
47 |
33 |
-5/18 |
2 |
- |
4 |
35 |
45 |
65 |
- |
TO-247-4 |
SiC MOSFET |
|
6 |
GCC120N060F4EB |
1200 |
N |
34 |
24 |
-5/18 |
2 |
- |
4 |
56 |
78 |
108 |
- |
TO-247-4 |
SiC MOSFET |
|
7 |
GCC120N075F3FB |
1200 |
N |
39 |
28 |
-5/18 |
2 |
- |
4 |
58 |
75 |
104 |
- |
TO-247-3 |
SiC MOSFET |
|
8 |
GCC120N075F4FB |
1200 |
N |
39 |
28 |
-5/18 |
2 |
- |
4 |
58 |
75 |
104 |
- |
TO-247-4 |
SiC MOSFET |
|
9 |
GCC150N020F4EB |
1500 |
N |
86 |
61 |
-5/18 |
2 |
3.3 |
4 |
20 |
25 |
36.4 |
- |
TO-247-4 |
SiC MOSFET |
|
10 |
GAC170N015F4EB |
1700 |
N |
153 |
108 |
-5/18 |
2 |
2.9 |
4 |
15 |
21 |
27 |
- |
TO-247-4 |
SiC MOSFET |
|
11 |
GYC170N1K0F3BB |
1700 |
N |
5 |
3.2 |
-5/20 |
2 |
3.1 |
4 |
1060 |
1350 |
998 |
1250 |
TO-247-3 |
SiC MOSFET |
|
12 |
GYC170N1K0F4BB |
1700 |
N |
5 |
3.2 |
-5/20 |
2 |
3.1 |
4 |
1060 |
1350 |
2100 |
- |
TO-247-4 |
SiC MOSFET |
|
13 |
GYC170N019F3BB |
1700 |
N |
132 |
84 |
-5/20 |
2 |
2.75 |
4 |
19 |
28 |
46 |
- |
TO-247-3 |
SiC MOSFET |
|
14 |
GYC170N019F4BB |
1700 |
N |
132 |
84 |
-5/20 |
2 |
2.8 |
4 |
19 |
26 |
26 |
- |
TO-247-4 |
SiC MOSFET |
|
15 |
GYC170N045F3BB |
1700 |
N |
67 |
45 |
-5/20 |
2 |
2.8 |
4 |
45 |
70 |
78 |
- |
TO-247-3 |
SiC MOSFET |
|
16 |
GYC170N045F4BB |
1700 |
N |
67 |
45 |
-5/20 |
2 |
2.8 |
4 |
45 |
70 |
78 |
- |
TO-247-4 |
SiC MOSFET |
|
17 |
GYC170N075F3BB |
1700 |
N |
33 |
29 |
-5/20 |
2 |
2.9 |
4 |
75 |
95 |
186 |
- |
TO-247-3 |
SiC MOSFET |
|
18 |
GYC170N075F4BB |
1700 |
N |
33 |
29 |
-5/20 |
2 |
2.5 |
4 |
75 |
95 |
105 |
- |
TO-247-4 |
SiC MOSFET |
Model Recommendations
|
No. |
Part No. |
VRRM [V] |
IF(A) |
VF(V) (TJ=25℃) |
VF(V) (TJ=175℃) |
Package |
Product |
||
|
TC=110℃ |
Typ. |
Max. |
Typ. |
Max. |
|||||
|
1 |
GNC065B010D4EB |
650 |
10 |
1.4 |
1.75 |
1.7 |
1.9 |
TO-220F-2 |
SJ MOSFET |
|
2 |
GNC065B010D2EB |
650 |
10 |
1.4 |
1.75 |
1.7 |
1.9 |
TO-220-2 |
SJ MOSFET |
|
3 |
GXC065B010D1GB |
650 |
10 |
1.4 |
1.75 |
1.7 |
1.9 |
Internal insulation of TO-220-2 |
SJ MOSFET |
|
4 |
GNC065B010E2EB |
650 |
10 |
1.4 |
1.75 |
1.7 |
1.9 |
TO-252 |
SJ MOSFET |
|
5 |
GNC065B010LEB |
650 |
10 |
1.5 |
1.8 |
1.8 |
- |
DFN8×8 |
SJ MOSFET |
|
6 |
GNC065B020D4EB |
650 |
20 |
1.47 |
1.7 |
1.82 |
2.5 |
TO-220F-2 |
SJ MOSFET |
|
7 |
GNC065B020D2EB |
650 |
20 |
1.47 |
1.7 |
1.82 |
2.5 |
TO-220-2 |
SJ MOSFET |
|
8 |
GNC065B020D1EB |
650 |
20 |
1.47 |
1.7 |
1.82 |
2.5 |
Internal insulation of TO-220-2 |
SJ MOSFET |
|
9 |
GNC065B020F2EB |
650 |
20 |
1.47 |
1.7 |
1.82 |
2.5 |
TO-247-2 |
SJ MOSFET |
|
10 |
GNC065B020F3EGB |
650 |
20 |
1.33 |
1.7 |
1.64 |
1.8 |
TO-247-3 |
SJ MOSFET |
|
11 |
GNC065B030D1EB |
650 |
30 |
1.41 |
1.7 |
1.68 |
2 |
Internal insulation of TO-220-2 |
SJ MOSFET |
|
12 |
GNC065B030F2EB |
650 |
30 |
1.41 |
1.7 |
1.68 |
2 |
TO-247-2 |
SJ MOSFET |
|
13 |
GNC065B040F2EB |
650 |
40 |
1.46 |
1.75 |
1.81 |
- |
TO-247-2 |
SJ MOSFET |
|
14 |
GNC065B040F3EB |
650 |
40 |
1.45 |
1.75 |
1.79 |
- |
TO-247-3 |
SJ MOSFET |
|
15 |
GNC065B050F2EB |
650 |
50 |
1.47 |
1.7 |
1.80 |
2.5 |
TO-247-2 |
SJ MOSFET |
|
16 |
GNC120B010D2GB |
1200 |
10 |
1.47 |
1.7 |
2.23 |
2.5 |
TO-220-2 |
SJ MOSFET |
|
17 |
GNC120B010F2GB |
1200 |
10 |
1.47 |
1.7 |
2.23 |
2.5 |
TO-247-2 |
SJ MOSFET |
|
18 |
GNC120B015F2GB |
1200 |
15 |
1.4 |
1.7 |
1.95 |
2.5 |
TO-247-2 |
SJ MOSFET |
|
19 |
GNC120B020F2EB |
1200 |
20 |
1.45 |
1.8 |
2 |
- |
TO-247-2 |
SJ MOSFET |
|
20 |
GNC120B020F3EB |
1200 |
20 |
1.45 |
1.8 |
2 |
- |
TO-247-3 |
SJ MOSFET |
|
21 |
GNC120B030F2EB |
1200 |
30 |
1.42 |
1.8 |
1.96 |
- |
TO-247-2 |
SJ MOSFET |
|
22 |
GNC120B030F3EB |
1200 |
30 |
1.45 |
1.8 |
1.95 |
- |
TO-247-3 |
SJ MOSFET |
|
23 |
GNC120B040F2FB |
1200 |
40 |
1.45 |
1.75 |
2.05 |
- |
TO-247-2 |
SJ MOSFET |
|
24 |
GNC120B040F3EB |
1200 |
40 |
1.45 |
1.8 |
2 |
- |
TO-247-3 |
SJ MOSFET |
|
25 |
GAC170B010F2EB |
1700 |
10 |
1.45 |
1.7 |
2.1 |
- |
TO-247-2 |
SJ MOSFET |
|
26 |
GAC170B025F2EB |
1700 |
25 |
1.45 |
1.7 |
2.1 |
- |
TO-247-2 |
SJ MOSFET |
|
27 |
GAC170B050F2EB |
1700 |
50 |
1.45 |
1.6 |
1.95 |
2.3 |
TO-247-2 |
SJ MOSFET |
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Email:
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