CS Asia Asian Compound Semiconductor Conference

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The CS Asia Asian Compound Semiconductor Conference was held in Shanghai. As a highly influential professional event in the Asian compound semiconductor sector, the conference took place concurrently with SEMICON China, focusing on wide-bandgap semiconductor materials such as silicon carbide and gallium nitride, as well as power devices, RF components, and optoelectronic technologies. It featured numerous thematic sessions exploring the industrialization opportunities for compound semiconductors driven by AI computing, new energy, and telecommunications infrastructure, bringing together experts from both domestic and international fields of materials, device development, chip design, and system applications to establish a platform for cutting-edge technology exchange and industry collaboration.

The CS Asia Asian Compound Semiconductor Conference was held in Shanghai. As a highly influential professional event in the Asian compound semiconductor sector, the conference took place concurrently with SEMICON China, focusing on wide-bandgap semiconductor materials such as silicon carbide and gallium nitride, as well as power devices, RF components, and optoelectronic technologies. It featured numerous thematic sessions exploring the industrialization opportunities for compound semiconductors driven by AI computing, new energy, and telecommunications infrastructure, bringing together experts from both domestic and international fields of materials, device development, chip design, and system applications, and establishing a platform for cutting-edge technology exchange and industry collaboration.

This conference focuses on addressing the technical bottlenecks, production‑scale stability, and pathways for domestic supply‑chain development of wide‑bandgap semiconductors in high‑voltage, high‑frequency, and high‑temperature applications. On site, in-depth discussions were held with industry experts and upstream and downstream partners on topics such as power semiconductor device architectures, chip design optimization, and device reliability testing, sharing practical experiences in deploying semiconductor components across communication equipment, industrial electrical control systems, and smart‑hardware applications. In response to the industry’s widespread emphasis on miniaturization, low loss, and high reliability, the event also explored integrated solution approaches—including chip architecture optimization, component selection and matching, and system integration—and examined implementation strategies for compound‑semiconductor devices in emerging application scenarios.

Leveraging mature component‑level design expertise and robust supply‑chain delivery capabilities, our product portfolio encompasses discrete semiconductor devices, power‑electronics components, and complementary integrated‑circuit solutions. We seamlessly balance standardized mass‑production supply with customized development, ensuring compatibility with the hardware requirements of wide‑bandgap device‑based systems. In addition, we possess strong technical R&D, solution‑validation, and cross‑border logistics capabilities, enabling us to provide end‑to‑end support for downstream equipment manufacturers—covering everything from solution evaluation and prototype validation to full‑scale production deliveries.

With the rapid growth of AI, new energy, and high-speed communications industries, the wide-bandgap compound semiconductor market has entered a period of accelerated expansion, driving downstream end‑users to demand higher device performance and greater supply‑chain reliability. Leveraging CS Asia—a premier platform for industry dialogue—we will continue to monitor cutting-edge technological trends in global compound semiconductors and facilitate connections across the upstream and downstream value chain. Moving forward, we will deepen our R&D efforts in power devices and integrated circuit solutions, enhance product reliability metrics, and refine our supporting technical service ecosystem, thereby enabling the large‑scale deployment of domestically produced semiconductor components in an expanding array of high‑end applications and fostering synergistic development throughout the compound semiconductor industry chain.

electronica Shanghai – Munich Shanghai Electronics Show

SEMICON CHINA, the Shanghai International Semiconductor Exhibition

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